Industry Directory: grid lok problems (4)

Ovation Products

Industry Directory | Manufacturer

Pioneer of numerous productivity enhancing tools designed to optimize SMT electronic equipment and processes. Innovator of the award-winning Grid-Lok, Magna-Print and Stinger technologies.

Asahitec Stencils Pvt. Ltd

Industry Directory | Manufacturer

Asahitec offers high precision and high quality products guaranteeing only the best in photoengraving and imaging technologies. Asahitec offers world class products without compromising on quality and is respected by customers.

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New SMT Equipment: grid lok problems (1692)

Rework and Repair Services

Rework and Repair Services

New Equipment | Rework & Repair Services

In order to maintain the highest level of quality in electronics, most manufacturers will employ some form of process control methodology to identify faulty conditions or potential quality variances. The feedback provided by such a system must natur

ACI Technologies, Inc.

BGA Repair Service

BGA Repair Service

New Equipment | Rework & Repair Services

Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA

BEST Inc.

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Electronics Forum: grid lok problems (200)

Grid lok system

Electronics Forum | Thu Feb 16 09:37:11 EST 2006 | mgillespie

hi, > > we tried to introduce form-flex a few > years back and it caused more problems than it > fixed. > > Switched back to pins and no > problems. > > It might have improved since but I > would be reluctant to get them again unless I was >

Grid lok system

Electronics Forum | Thu Feb 16 03:43:54 EST 2006 | aj

hi, we tried to introduce form-flex a few years back and it caused more problems than it fixed. Switched back to pins and no problems. It might have improved since but I would be reluctant to get them again unless I was given a 6 month trial!! aj

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Used SMT Equipment: grid lok problems (45)

MPM Momentum+ Printer

MPM Momentum+ Printer

Used SMT Equipment | Screen Printers

MPM Momentum+ Printer Substrate treatment                                                       Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite  457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Assembleon Topaz XII

Assembleon Topaz XII

Used SMT Equipment | Pick and Place/Feeders

Assembleon Topaz XII Pick & Place Model: Topaz II Vintage: 2004 Grid-Lok Max Board Size: 18" x 17.3" 20,000 CPH 0201 Capable 8 Head - Single Beam Complete & Operational Various Feeders Available

Midwest SMT

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Industry News: grid lok problems (76)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

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Parts & Supplies: grid lok problems (5)

DEK BOOM  BOARD CLAMPS 500MM

DEK BOOM BOARD CLAMPS 500MM

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

DEK BOOM 500MM BOARD CLAMPS

DEK BOOM 500MM BOARD CLAMPS

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

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Technical Library: grid lok problems (2)

Ball Grid Array (BGA) Voiding Affecting Functionality

Technical Library | 2020-11-09 16:59:53.0

A customer contacted ACI Technologies regarding a high failure rate of their assemblies. They provided assemblies to be X-rayed and inspected for the purpose of identifying any process related issues such as (but not limited to) solder and assembly workmanship and evidence of damage due to moisture related problems during reflow (a.k.a. "popcorning"). Moisture damage usually appears as physical damage to the component. The first indication of moisture damage would be externally observable changes to the package in the form of bulging or fractures to the outer surface of the component, an example of which is shown in Figure 1. Internally observable indicators of moisture damage typically include fractures to the die inside the package and lifted or fractured wire bonds. These conditions would be apparent during transmissive X-ray inspection. Another symptom of moisture related damage would be inconsistent solder joint sizes that result from package deformation during the liquidus phase of the reflow process. None of these indicators of moisture related damage were present on the customer samples.

ACI Technologies, Inc.

Via In Pad - Conductive Fill or Non-Conductive Fill?

Technical Library | 2020-07-15 18:29:34.0

In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.

Advanced Circuits

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Videos: grid lok problems (10)

MPM MOMENTUM+ PRINTER / M202388

Videos

Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema

Qinyi Electronics Co.,Ltd

MPM MOMENTUM+ PRINTER/M202395

Videos

Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema

Qinyi Electronics Co.,Ltd

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Events Calendar: grid lok problems (1)

Everything You Need to Know About X-Rays

Events Calendar | Wed Jun 20 00:00:00 EDT 2018 - Wed Jun 20 00:00:00 EDT 2018 | ,

Everything You Need to Know About X-Rays

Creative Electron Inc

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Career Center - Jobs: grid lok problems (1)

Manufacturing Engineer

Career Center | Pullman, Washington USA | Engineering

The Opportunity: Schweitzer Engineering Laboratories (SEL) seeks a professional, innovative and detailed individual for our Manufacturing Engineer position. If you are looking for an opportunity to contribute your skills and abilities to our growing

Schweitzer Engineering Laboratories

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Career Center - Resumes: grid lok problems (3)

Project Manager - Electronics Products

Career Center | , | Engineering,Production

Project Management, SMT Process Engineering

PROCESS/PRODUCTION ENGINEER-PCB ASSEMBLY (SMT AND PTH)

Career Center | Derabassi, India | Maintenance,Management,Production,Quality Control,Sales/Marketing

PCB Assembly (SMT & PTH)--Process/Planning – Production – Maintenance/Troubleshooting – QA/QC

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Express Newsletter: grid lok problems (392)


grid lok problems searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling Machine with CE

Stencil Printing 101 Training Course
Fluid Dispensing Aerospace

Best Reflow Oven
Selective soldering solutions with Jade soldering machine

World's Best Reflow Oven Customizable for Unique Applications
Equipment Auction - Eagle Comtronics: Low-Use Electronic Assembly & Machining Facility 2019 Europlacer iineo + Placement Machine  Test & Inspection: Agilent | Tektronix | Mantis Machine Shop: Haas VF3 | Haas SL-20 | Mult. Lathes

Reflow Soldering 101 Training Course
PCB separator

Thermal Transfer Materials.